MEMS PROCESSING

The CPD 408 has been developed for critical point drying of large, flat specimens e.g. wafers for MEMS. The unique double chamber system ensures a minimum consumption of CO2. The handling is very simple and the fully automatic process is computer controlled.

  • MAC 240 Deposition Device

  • Simple one button operation
  • Easy to loading / unloading of master through magnetic coupling
  • Fast target changes as well as quick and user friendly maintenance
  • Compatible with all common mastering processes (Ni, Ni/Va Ag)
  • Low target material cost
  • Small footprint, single phase, no external water cooling required

The MAC 240 has been designed to coat 180 / 240mm CD and DVD masters with nickel, nickel/vanadium or silver. The simple and reliable coater is available as stand-alone or as OEM in-line unit.

  • URC 300 Coil to Coil Foil Coater

  • Non-creasing coil to coil sputter system for foils down to 2µm thickness
  • Metallization with various materials (i.e. Cr, Pt, Au...)
  • Surface resistance controlled coating
  • Transparent conducting coatings or coatings for foil capacitors
  • Economical operation
  • Excellent visual access