MEMS PROCESSING
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The CPD
408 has been developed for critical point drying of large,
flat specimens e.g. wafers for MEMS. The unique double chamber
system ensures a minimum consumption of CO2. The handling
is very simple and the fully automatic process is computer
controlled.
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- MAC
240 Deposition Device
- Simple one button
operation
- Easy
to loading / unloading of master through magnetic coupling
- Fast
target changes as well as quick and user friendly maintenance
- Compatible
with all common mastering processes (Ni, Ni/Va Ag)
- Low target
material cost
- Small
footprint, single phase, no external water cooling required
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The MAC
240 has been designed to coat 180 / 240mm CD and DVD masters
with nickel, nickel/vanadium or silver. The simple and reliable
coater is available as stand-alone or as OEM in-line unit.
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- URC
300 Coil to Coil Foil Coater
- Non-creasing coil
to coil sputter system for foils down to 2µm thickness
- Metallization
with various materials (i.e. Cr, Pt, Au...)
- Surface
resistance controlled coating
- Transparent
conducting coatings or coatings for foil capacitors
- Economical
operation
- Excellent
visual access
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