• TIC 020 Tripple Ion beam Cutter

The BAL-TEC TIC020 Triple Ion beam Cutter for preparation of slope cuts allows accurate and efficient site specific sample preparation for SEM imaging, complementary to the current FIB (Focused Ion Beam) technique.

The TIC 020 features three ion beams with a three axis stage and a viewing microscope. This configuration leads to a time and cost efficient sample preparation procedure with high ROI (Return on Investment).

• RES 101 Ion Milling Device
  
  
• Fully computer controlled system
• Variable milling angle from 0° to 90°
• All in one system with the highest level of user flexibility
• Load lock system for permanent high vacuum
• Variable ion energy for high and low energy milling processes
• Built in CCD camera
• Integrated application library

The RES 101 is an ion beam milling device that combines the preparation of TEM, SEM and LM samples in one single bench top unit. Many accessories like the sputter table for in-situ coating and a special holder for FIB cleaning make this system extremely versatile for all users.

• RES 120 SEM Controlled Broad Ion Beam Milling System
  
  
• Ion beam milling with in-situ SEM observation
• Fully computer controlled
• Material related investigation
• Variable energy and milling angles similar to the RES 101
• Integrated library
• Specimen control wia BSE detection
• Process evaluation via high resolution SEM

The RES 120 RESSEM is the combination of conventional ion beam preparation and in-situ SEM monitoring for target specific preparation in the nm range.

• RES 005 FIBTEM
  
  
• LVFIB (low voltage focused ion beam) for in-situ TEM ion milling
• Retrofitable to most TEMs

The ion microscope works on low voltage focused ion beam (LVFIB) comprising a liquid gallium cathode, transfer optics, deflection unit and electronic supply for in-situ ion milling in the TEM.

• X-TEM Kit
  
  
• No dimpling required
• No ultrasonic disc cutting required
• Mounting device for "Face to Face" adhesion
• Levels on the calibration stage and the tripod for polishing allow exact plane parallel polishing
• Fluorescent Ti carriers
• Plane parallel and wedge shaped polishing down to 30µm

• DWS 010 Diamond Wheel Saw
  
  
• Minimal sample surface damage
• Universal sample holder
• Automatic cut-off on completion of the cutting process
• Easy change of coolant

• WSD 020 Wire Saw Device
  
  
• Minimal sample surface damage
• Universal sample holder
• Automatic cut-off on completion of the cutting process
• Easy change of coolant

• ADD 010 Automatic Dimpling Device
  
  
• Minimal sample surface damage
• Automatic cut-off on dimpling operation termination
• Drive belts and precision bearings for minimized vibrations

• Scandimatic 37305 Universal Polishing Machine
  
  
• No dimpling required
• No ultrasonic disc cutting required
• Mounting device for "Face to Face" adhesion
• Levels on the calibration stage and the tripod polisher allows exact plane parallel polishing
• Fluorescent Ti carriers
• Plane parallel and wedge shaped polishing down to 30µm

• UDC 020 Ultrasonic Disc Cutting Device
  
  
• Compact table unit
• Unique electronic control for maximum performance cutting
• Automatic load counter balancing
• Easy to set for desired sample areas